New technology of LED heat dissipation

LED chips in LED lamps are electronic components with high heat flux density. During operation, due to their static and dynamic losses, a large amount of excess heat is generated, which is dissipated to the outside through the heat dissipation system to maintain the stability of their operating temperature. At present, the luminous efficiency of LEDs is still relatively low, resulting in an increase in junction temperature and a decrease in life. In order to reduce the junction temperature and increase the life span, it is necessary to attach great importance to the problem of heat dissipation. The heat dissipation design of the LED must start from the chip all the way to the entire heat sink, and every link must be given full attention. Improper design of any link will cause serious heat dissipation problems. Therefore, full attention must be paid to the design of heat dissipation.

The high-performance micro-groove group composite phase change heat transfer technology meets the heat dissipation requirements of high-power LED lighting. The technology is named "micro-groove group composite phase change integrated cooling technology". This technology has been successfully applied to LED lamps. The heat of LED chips can be distributed in the entire heat dissipation space instantly, extending the life of LED lamps and improving the luminous efficiency.

1. Micro-groove group composite phase change integrated cooling technology:

The heat generated by the LED chip is eventually dissipated into the air through the lamp housing. The general heat dissipation is: the heat generated by the LED chip comes out of its metal heat dissipation block, and then passes through the solder to the PCB of the aluminum substrate, and then passes through the thermal conductive glue to the aluminum radiator. The heat dissipation of LED lamps actually includes heat conduction and heat dissipation. There is a concept to understand first, that is, the difference between heat conduction and heat dissipation. Heat conduction is to transfer heat from the heat source to the surface of the radiator as quickly as possible, while heat dissipation is to radiate heat from the surface of the radiator to the air. First, the fastest heat must be exported, and then it must be most effectively dissipated into the air. The heat sink of the traditional radiator is aluminum fins, our heat sink is: micro-groove group phase change technology.

The micro-groove group phase-change cooling technology relies on technical means (such as equipment structure: micro-groove and other means) to turn the closed circulation cooling medium (if the medium is water) into a nano-scale water film. The thinner the water film, the ability to evaporate when heated The stronger, the stronger the latent heat exchange ability, the heat of the high-power electronic device is taken away by the steam.   

Cooler system composition and working principle:

1. The composition of the cooler: namely the heat extractor, the condenser, the transmission pipeline, and the heat medium (such as water, ethanol, etc.).

The heat extractor is generally made of imported aluminum alloy, and the inner cavity of the plate has many channels of the order of micrometers. Its function is to change the heat medium (such as water) into the required liquid film, heating power device and aluminum alloy according to the design requirements. The surface is in close contact, and its heat energy is transferred to the liquid film through aluminum heat, and the liquid film is instantaneously vaporized, and the heat energy is sent to the condenser for cooling through the pipeline. Due to the strong heat extraction capacity of the heat extractor, its thermal conductivity is greater than 106 W / (m * ℃), so the volume of the heat extractor can be made very small.

The condenser is usually made of imported aluminum alloy, the inner cavity of the plate has many channels of the order of millimeters, and the aluminum alloy plate has fins outside. The heat medium is sent to heat energy through the pipeline. It is responsible for convection heat exchange with outdoor air and Radiative heat exchange, the heat energy of the heat extraction medium is released through the condenser, and changes from the vapor state to the liquid state. The liquid heat extraction medium returns to the heat extractor by its own gravity, ready for the next heat energy exchange cycle.


low voltage electric appliances is a kind of equipment that can manually or automatically connect and disconnect the circuit,according to the requirements of the outside . In order to realize the circuit or non-electric object switching, control, protection, detection, transformation and adjustment. Korlen electrical appliances can provide the perfect(quality and service) products with good safety: AC Contactor,Thermal Relay,Manual Motor Startor etc.


AC contactor:

pe

KNC1-09

KNC1-12

KNC1-18

KNC1-25

KNC1-32

KNC1-40

KNC1-50

KNC1-65

KNC1-80

KNC1-95

Pick-up voltage
50/60Hz(V)

(0.85~
1.1)Us

(0.85~
1.1) Us

(0.85~
1.1)Us

(0.85~
1.1)Us

(0.85~
1.1)Us

(0.85~
1.1)Us

(0.85~
1.1)Us

(0.85
~1.1)Us

(0.85~
1.1)Us

(0.85~
1.1)Us

Release voltage
50/60Hz(v)

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

(0.2~
0.75)Us

Coil power

50Hz

60Hz
 

Pick-up(VA)

70

70

110

110

110

200

200

200

200

200

Holding(VA)

8

8

11

11

11

20

20

20

20

20

Pick-up(VA)

80

80

115

115

115

200

200

200

200

200

Holding(VA)

8

8

11

11

11

20

20

20

20

20

Power
consumption
(W)

1.8~2.7

1.8~2.7

3~4

3~4

3~4

6~10

6~10

6~10

6~10

6~


Low Voltage Transformer


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Low Voltage Transformer

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