Taiwan is always asked to be asked about TSMC and who is most likely to be a potential competitor to TSMC. It should be said that TSMC has far ahead of its competitors in the current foundry factory. However, there is no concern but it is far-fetched.
I think of writing an article on TSMC because I saw an article about IC manufacturing equipment technology in mainland China this morning. IC manufacturing equipment: Ten years to catch up, where does confidence come from? Wang Wen, an academician of the Chinese Academy of Sciences, expects that by 2020, China's integrated circuit manufacturing equipment technology is expected to stand at the same level as foreign developed countries. Academician Wang is so optimistic. I really don't know where confidence comes from. A friend of mine said that the frog in the well is a success. It is to jump out of that well and go back to the topic without going back to gossip.
As far as the current fab is concerned, it is obviously non-Global foundries that are the most threatening to TSMC. After all, Arabs have money because of the shortage of oil. GF has enough strength to compete with TSMC in the advanced manufacturing process, but with TSMC’s foundry. The factory is spread all over Taiwan. GF's fabs are all over the world. It is difficult for the integration of technology. This may be because GF is at a disadvantage in competition with TSMC. Of course, fabs all over the world will also bring different cultures. Fusion issues.
Not long ago, Intel CEO Otellini predicted that the future of wafers may be surplus. It's a bit sour, but there is a reason. After all, everyone will compete for factory production and the tender growth will be very fast. However, there is a tendency that IDM has transformed into Fabless and production capacity is continuously being released. In fact, in the long run, Intel’s foundry wafers for other customers are definitely a trend. It has been reported recently that Intel started to build a small company. However, compared with TSMC, although Intel does not lack money, the process is even more advanced. It is not necessary to meet the technical requirements of foundry as TSMC does, or that Intel needs a certain amount of time to renovate. Not long ago, Intel just announced that it will invest 5 billion US dollars in the construction of a wafer factory in Arizona, once the future demand for PC CPU market is insufficient. Intel's determination to shift to foundry is not necessarily, but it should not be in the near future.
In fact, TSMC’s biggest competitor is Samsung. With the strong support of the Korean government in previous years, Samsung has blossomed in various fields such as consumer electronics, mobile phones, semiconductors, panels, and memory. The wafer manufacturing process is not as bad as TSMC. At present, the main problem is that Samsung really needs to vigorously conduct foundry business. It needs to separate the fab from the Samsung Group. The reason why Apple transferred the processor business from Samsung to TSMC is also because it is related to the Samsung Group on mobile phones. In areas such as processors, there is competition. If foundry is not separated from the group, Samsung will find it difficult to attract large customers. Therefore, as long as Samsung is determined, there is a high probability that TSMC will pose a threat in the next few years.
In the end, I have to talk about the mainland fabs. Compared with TSMC, the gap between SMIC is too great to compete at the same level. Currently, the market value of TSMC is close to US$65 billion. SMIC has only 2 billion, which means Selling SMIC has also failed to build an advanced fab. The gap is evident. In 2010, SMIC’s profitability was related to global capacity constraints. However, compared with TSMC, there are too many processes behind it. TSMC and GF are currently in the process. All of them are expanding their production capacity, and OEM prices will gradually decline. Once the price of advanced process OEMs declines, the second-line process will also decline, which will threaten the overall business of SMIC. The SMIC's desire to catch up with TSMC's estimates is just as difficult as the mainland's cottage manufacturers to catch up with Apple. This is the reason why SMIC's share price is still not recognized in the capital market even after it achieves its first annual profit.
Another factor in the inability of mainland wafer manufacturing to surpass TSMC is that the United States is concerned about the rise of China. Dad said in blogs that IT has become a strategic resource for the United States. Some of the outdated processes can be transferred. First, it should not affect the U.S. strategy. Under the premise, perhaps relying on self-reliance can create two bombs and one star, but it is too difficult to stand at the same level as developed countries in the field of integrated circuit manufacturing equipment technology within 10 years. (Old man)
I think of writing an article on TSMC because I saw an article about IC manufacturing equipment technology in mainland China this morning. IC manufacturing equipment: Ten years to catch up, where does confidence come from? Wang Wen, an academician of the Chinese Academy of Sciences, expects that by 2020, China's integrated circuit manufacturing equipment technology is expected to stand at the same level as foreign developed countries. Academician Wang is so optimistic. I really don't know where confidence comes from. A friend of mine said that the frog in the well is a success. It is to jump out of that well and go back to the topic without going back to gossip.
As far as the current fab is concerned, it is obviously non-Global foundries that are the most threatening to TSMC. After all, Arabs have money because of the shortage of oil. GF has enough strength to compete with TSMC in the advanced manufacturing process, but with TSMC’s foundry. The factory is spread all over Taiwan. GF's fabs are all over the world. It is difficult for the integration of technology. This may be because GF is at a disadvantage in competition with TSMC. Of course, fabs all over the world will also bring different cultures. Fusion issues.
Not long ago, Intel CEO Otellini predicted that the future of wafers may be surplus. It's a bit sour, but there is a reason. After all, everyone will compete for factory production and the tender growth will be very fast. However, there is a tendency that IDM has transformed into Fabless and production capacity is continuously being released. In fact, in the long run, Intel’s foundry wafers for other customers are definitely a trend. It has been reported recently that Intel started to build a small company. However, compared with TSMC, although Intel does not lack money, the process is even more advanced. It is not necessary to meet the technical requirements of foundry as TSMC does, or that Intel needs a certain amount of time to renovate. Not long ago, Intel just announced that it will invest 5 billion US dollars in the construction of a wafer factory in Arizona, once the future demand for PC CPU market is insufficient. Intel's determination to shift to foundry is not necessarily, but it should not be in the near future.
In fact, TSMC’s biggest competitor is Samsung. With the strong support of the Korean government in previous years, Samsung has blossomed in various fields such as consumer electronics, mobile phones, semiconductors, panels, and memory. The wafer manufacturing process is not as bad as TSMC. At present, the main problem is that Samsung really needs to vigorously conduct foundry business. It needs to separate the fab from the Samsung Group. The reason why Apple transferred the processor business from Samsung to TSMC is also because it is related to the Samsung Group on mobile phones. In areas such as processors, there is competition. If foundry is not separated from the group, Samsung will find it difficult to attract large customers. Therefore, as long as Samsung is determined, there is a high probability that TSMC will pose a threat in the next few years.
In the end, I have to talk about the mainland fabs. Compared with TSMC, the gap between SMIC is too great to compete at the same level. Currently, the market value of TSMC is close to US$65 billion. SMIC has only 2 billion, which means Selling SMIC has also failed to build an advanced fab. The gap is evident. In 2010, SMIC’s profitability was related to global capacity constraints. However, compared with TSMC, there are too many processes behind it. TSMC and GF are currently in the process. All of them are expanding their production capacity, and OEM prices will gradually decline. Once the price of advanced process OEMs declines, the second-line process will also decline, which will threaten the overall business of SMIC. The SMIC's desire to catch up with TSMC's estimates is just as difficult as the mainland's cottage manufacturers to catch up with Apple. This is the reason why SMIC's share price is still not recognized in the capital market even after it achieves its first annual profit.
Another factor in the inability of mainland wafer manufacturing to surpass TSMC is that the United States is concerned about the rise of China. Dad said in blogs that IT has become a strategic resource for the United States. Some of the outdated processes can be transferred. First, it should not affect the U.S. strategy. Under the premise, perhaps relying on self-reliance can create two bombs and one star, but it is too difficult to stand at the same level as developed countries in the field of integrated circuit manufacturing equipment technology within 10 years. (Old man)
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