TSMC recently announced that the first phase of the new Fab 15 300mm wafer fab has been installed, and mass production of the 28nm process is expected to begin at the end of this year. The Fab 15 fab broke ground in July 2010. TSMC had previously planned to install equipment in June and began mass production of new processes in the first quarter of 2012. However, Jason Chen, the deputy general manager of global marketing, recently revealed that the new plant will begin trial production in the third quarter. The fourth quarter will be put into mass production. With this new plant, TSMC’s 300mm wafers will have monthly production capacity of more than 300,000.
Equivalent to 200 mm wafers, TSMC’s total capacity exceeded 10 million for the first time in 2010, and Chen Junsheng expects to double by 2015.
Chen Junsheng said that TSMC is still actively seeking to enter the field of packaging and testing in the latter part of the year, and has recruited more than 250 new employees to enhance R & D efforts, and also developed its own lead-free bump packaging technology.
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