In recent years, the rapid development of semiconductor Lighting has gradually changed in the form of high-power LED packaging, including formal, flip-chip, and vertical structures. For many years, the formal wear has been leading the LED packaging market, but as the LED power is larger and the structure is stable and the requirements for light output are slowly catching up, it is unstoppable. With the mass production of flip-chips and the decline in costs, there is already a place in the market. Looking back, let's take a look at the vertical structure LED. The vertical structure LED has an incomparable advantage in the chip structure, but the development in the market has been tepid. There are several reasons. The package wants to use the characteristics of the vertical structure. Vertical structure LED high power film package.
The package we introduced this time is to change the previous gold wire and complete the package in the form of hot pressing of transparent conductive film. In this way, the current injection of the high-power LED is more stable, the current density is smaller, and the cost of the gold wire can be reduced, and the thin film package can be made thinner and lighter. The product launched this time is a 40MIL chip, 3535 ceramic substrate package, which is superior to the traditional gold wire package at high current.
Next in the field of vertical structure chips, the N-face electrode can be further optimized and achieve greater lumens.
Zhejiang Baishili Battery Technology Service Co,.Ltd. , https://www.bslbatteryservice.com