On June 26, the “2012 China Electronic Components Industry Summit†co-sponsored by the Office of Operation and Coordination of the Ministry of Industry and Information Technology, the Electronic Information Department of the Ministry of Industry and Information Technology, and the China Electronic Component Industry Association was held in Hangzhou. He was attended by the chief economist of Zhou Zixue of the Ministry of Industry and Information Technology, Deputy Director Gao Sumei of the Bureau of Supervision and Coordination of the Ministry of Industry and Information Technology, and Deputy Director of the Electronic Information Department of the Ministry of Industry and Information Technology.
The main content of this conference is to interpret the 12th Five-Year Development Plan for the electronic component manufacturing industry, and further understand various emerging technologies in the industry. Deputy leaders of higher authorities such as Chief Economist Zhou Zixue, Deputy Director Gao Sumei, and Deputy Director General Yan Shijing analyzed the operation and development of China's electronic information manufacturing industry. Academician Ni Guangnan of the Chinese Academy of Engineering, Professor Feng Zhenming of Tsinghua University, and Ministry of Industry and Information Technology Directors of the Institute of Communications Standards Institute Wang Zhiqin, Professor Zhang Weihua of the National Traction Power Laboratory of Southwest Jiaotong University, and other industry experts discussed the status quo of cloud equipment, Beidou satellite navigation systems, TD-LTE technology, high-speed railways and high-speed trains in China. To analyze the trend, representatives from Hengtong Optoelectronics, Chaozhou Sanhuan, Zhejiang Fuchunjiang Opto-electronics Technology, and Dongguan Qinshang Optoelectronics made brilliant speeches in some areas of the electronic component industry. Relevant leaders commended the 25th China Top 100 Electronic Components companies.
The China Micro Assembly and Packaging Seminar will be held on June 27th. The meeting will analyze the development of LTCC materials and products. There will be presentations by experts in this field and representatives of excellent companies.
About 300 people participated in this session, mainly senior leaders of major companies in China's electronic components. The annual “China Electronic Component Industry Summit†is the largest and highest-level industry high-level meeting in the electronic components industry in China. It has become an information industry in China’s electronic components industry, exploring technological development, displaying corporate image, and finding partners. High quality platform.
The main content of this conference is to interpret the 12th Five-Year Development Plan for the electronic component manufacturing industry, and further understand various emerging technologies in the industry. Deputy leaders of higher authorities such as Chief Economist Zhou Zixue, Deputy Director Gao Sumei, and Deputy Director General Yan Shijing analyzed the operation and development of China's electronic information manufacturing industry. Academician Ni Guangnan of the Chinese Academy of Engineering, Professor Feng Zhenming of Tsinghua University, and Ministry of Industry and Information Technology Directors of the Institute of Communications Standards Institute Wang Zhiqin, Professor Zhang Weihua of the National Traction Power Laboratory of Southwest Jiaotong University, and other industry experts discussed the status quo of cloud equipment, Beidou satellite navigation systems, TD-LTE technology, high-speed railways and high-speed trains in China. To analyze the trend, representatives from Hengtong Optoelectronics, Chaozhou Sanhuan, Zhejiang Fuchunjiang Opto-electronics Technology, and Dongguan Qinshang Optoelectronics made brilliant speeches in some areas of the electronic component industry. Relevant leaders commended the 25th China Top 100 Electronic Components companies.
The China Micro Assembly and Packaging Seminar will be held on June 27th. The meeting will analyze the development of LTCC materials and products. There will be presentations by experts in this field and representatives of excellent companies.
About 300 people participated in this session, mainly senior leaders of major companies in China's electronic components. The annual “China Electronic Component Industry Summit†is the largest and highest-level industry high-level meeting in the electronic components industry in China. It has become an information industry in China’s electronic components industry, exploring technological development, displaying corporate image, and finding partners. High quality platform.
Bigger size 4-Layer FR4 PCB Board , the unit size is 530mm*476mm. We use FR4 TG150 material.about the outline we make routed and V-cut and the surface treatment is Immersion Gold.Min. Line Width/Min. Line Spacing: 0.15/0.2mm; With Single-terminal and differential Impedance Control.
The type of Printed Circuit Board used for industrial control.
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